All posts tagged: Dissipation

Apple could bring titanium back to iPhones to improve heat dissipation: Report | Technology News

Apple could bring titanium back to iPhones to improve heat dissipation: Report | Technology News

3 min readMay 21, 2026 04:19 PM IST Apple may not be done with titanium just yet. According to a new leak from Weibo tipster Instant Digital, the company is reportedly researching improved titanium materials for future iPhone models after recently shifting back to aluminium designs. Apple first introduced titanium with the iPhone 15 Pro lineup in 2023, positioning the material as a premium feature for its Pro smartphones. Titanium replaced stainless steel, helping reduce weight while maintaining durability, and quickly became one of the defining design changes for the Pro series. However, Apple reportedly moved away from titanium with the iPhone 17 Pro, instead using an aluminium-based chassis. Reports suggested that thermal performance and heat dissipation played a major role in the decision, as aluminium conducts heat more efficiently than titanium. Apple reportedly sees aluminium as a compromise According to the leak by the 9to5Mac website, Apple still views titanium as a superior premium material and considers the shift to aluminium a “forced compromise”. The company is now said to be exploring a revised …

iQOO 13 Tipped to Get New Heat Dissipation System, Supercomputing Chip Q2

iQOO 13 is expected to launch soon with the Snapdragon 8 Gen 4 chipset. The Vivo sub-brand is yet to announce a launch date but details about the handset are appearing on the Web. A new leak coming out of China suggests that the upcoming handset will get a new chip and heat dissipation system with a single-layer motherboard. The initial launch of the iQOO 13 could take place in China in November and it is expected to launch in India in early December. The iQOO 13 is likely to draw power from a 6,150mAh battery. A Weibo user familiar with the matter claims that the iQOO 13 will come with a new heat dissipation architecture with a single-layer motherboard for thermal management. The handset is said to boast a new VC heat sink as well (machine translated from Chinese). The same user in a separate post states that iQOO 13 will feature the company’s self-developed Q2 chip for gaming. Last year’s iQOO 12 and iQOO Neo 9 series pack Supercomputing Chip Q1 and are advertised to enable …