iQOO 13 is expected to launch soon with the Snapdragon 8 Gen 4 chipset. The Vivo sub-brand is yet to announce a launch date but details about the handset are appearing on the Web. A new leak coming out of China suggests that the upcoming handset will get a new chip and heat dissipation system with a single-layer motherboard. The initial launch of the iQOO 13 could take place in China in November and it is expected to launch in India in early December. The iQOO 13 is likely to draw power from a 6,150mAh battery. A Weibo user familiar with the matter claims that the iQOO 13 will come with a new heat dissipation architecture with a single-layer motherboard for thermal management. The handset is said to boast a new VC heat sink as well (machine translated from Chinese). The same user in a separate post states that iQOO 13 will feature the company’s self-developed Q2 chip for gaming. Last year’s iQOO 12 and iQOO Neo 9 series pack Supercomputing Chip Q1 and are advertised to enable …