Samsung Galaxy Z Fold 6 and Galaxy Z Flip 6 were launched in July with a new chipset, a slightly updated design, and a tweaked camera setup. Samsung is expected to unveil a budget-friendly foldable phone, that is said to be called the Galaxy Z Flip FE alongside the Galaxy Z Fold 7 and Galaxy Z Flip 7 next year. Their launch is still a ways off, but a new rumour reveals their potential chipset. Samsung’s next-generation foldable phones could run on the company’s in-house Exynos 2500 SoC, marking a departure from Qualcomm’s Snapdragon chipsets.  Samsung Galaxy Z Flip Series to Feature 3nm Exynos Chip South Korean publication Chosunbiz reports that Samsung Electronics will use the Exynos 2500 series chipset in Galaxy Z Flip FE and Galaxy Z Flip 7, as the company has succeeded in stabilising the 3nm manufacturing process (translated from Korean). Further, the report notes that Samsung previously planned to use the Exynos series designed by the Samsung Electronics System LSI division in the Galaxy S25 series. This was reportedly hampered by …