All posts tagged: semiconductor manufacturing

Digital India turns 11: UPI becomes world’s largest real-time payment system with 24,000 crore transactions in a year

Digital India turns 11: UPI becomes world’s largest real-time payment system with 24,000 crore transactions in a year

As the Digital India initiative completes 11 years, the Unified Payments Interface (UPI) has processed nearly 24,000 crore transactions in a year and has been recognised by the International Monetary Fund (IMF) as the world’s largest real-time payment system. As per the central government, UPI transactions increased from just two crore in FY 2016-17 to over 24,162 crore in FY 2025-26. (Shutterstock) As per the central government, UPI transactions increased from just two crore in FY 2016-17 to over 24,162 crore in FY 2025-26. As of March 2026, DigiLocker hosts over 850 crore documents, making document storage and verification easier, particularly for students. The UMANG app is currently being used by around 12 crore people, providing access to a wide range of government services. On the manufacturing front, according to sources, while India imported 74 per cent of its mobile phones in 2014, by 2025, nearly 48 per cent of mobile phones were manufactured in the country, reflecting the growth of domestic manufacturing. Also Read: ‘UPI will be operational in Seychelles by year-end’: MEA According …

IT ministry seeks ₹1 lakh crore for India Semiconductor Mission 2.0: Officials| India News

IT ministry seeks ₹1 lakh crore for India Semiconductor Mission 2.0: Officials| India News

The outlay for the India Semiconductor Mission (ISM) 2.0 is expected to exceed ₹1 lakh crore, the amount the IT ministry has sought from the government, officials aware of the matter said. An announcement on the second phase is expected by the end of April, with the ministry’s proposal currently under inter-ministerial consultation. India plans a ₹1 lakh crore-plus outlay for Semiconductor Mission 2.0 to boost chip design, manufacturing and domestic supply chains The first phase of the mission had an outlay of ₹76,000 crore and attracted investments of about ₹1.6 lakh crore. The ₹1 lakh crore sought by the IT ministry would be in addition to the ₹76,000 crore allocated in the first phase. As of December 2025, 10 projects have been approved, with four expected to begin chip production this year across six states under the first phase. These include silicon fabrication units, silicon carbide fabs, advanced and memory packaging facilities, and specialised assembly and testing infrastructure. “Phase 2 will involve additional fresh funding, as the funds allocated under the first phase have …

PM Modi Inaugurates Micron Technology ATMP Facility in Sanand, Gujarat | India News

PM Modi Inaugurates Micron Technology ATMP Facility in Sanand, Gujarat | India News

Last Updated:February 28, 2026, 22:28 IST The facility will assemble and package chips used in SSDs and RAM modules, linking India directly to global electronics supply chains. PM Modi during inauguration in Gujarat Prime Minister Narendra Modi on Saturday inaugurated Micron Technology’s Assembly, Testing, Marking and Packaging (ATMP) facility in Sanand, Gujarat, marking the launch of India’s first domestically produced semiconductor chips. The project positions Gujarat as an emerging centre in the global semiconductor supply chain. Addressing the gathering, PM Modi said the facility sends a strong message globally about India’s technological capability. He said the project shows that “India is capable, India is competitive, India is committed,” and reflects the country’s growing role in the global electronics ecosystem. The Prime Minister described the Sanand project as more than just an industrial investment. According to him, it demonstrates how policy support, manufacturing readiness and global confidence are coming together to strengthen India’s semiconductor mission. PM Modi also highlighted the importance of India’s partnership with the United States in advanced technologies. “Today’s program at this facility …

Broadcom and TSMC Consider Splitting Intel’s Design and Manufacturing Capabilities Between Them

Broadcom and TSMC Consider Splitting Intel’s Design and Manufacturing Capabilities Between Them

Rumors are swirling about a possible takeover of Intel. Nothing has been inked, but Broadcom and Taiwan Semiconductor Manufacturing Company (TSMC) both are in the early stages of proposing potential deals, according to The Wall Street Journal. Broadcom could potentially seek a deal for Intel’s chip design assets, while TSMC eyes its manufacturing capabilities. More about Innovation Intel interim executive chairman allegedly met with buyers, government Broadcom and TSMC are not officially working together, and any plans either company has for deals with Intel are in preliminary stages, The Wall Street Journal said. However, Intel’s Interim Executive Chairman Frank Yeary has allegedly met with potential buyers and Trump administration officials. TSMC’s involvement in particular would need to take into account Intel’s U.S. national security relationships. Intel was the largest recipient of the U.S. Chips Act of 2022, which gave up to $7.9 billion in grants to U.S.-based factory projects. Reception of that money makes Intel subject to regulations that say the company must own a majority share of its factories if they are sold off …

PM Modi Signs Big Semiconductor Deal With Singapore, Hails Country’s Inspiring Growth During Visit

Published on Sep 05, 2024 07:15 PM IST India and Singapore signed MoUs in fields of digital technology, semiconductor, and more. Prime Minister Narendra Modi also visited the Semiconductor facility of AEM Holdings Ltd in Singapore along with his Singaporean counterpart Lawrence Wong. “Singapore is not just a country, Singapore is an inspiration for every developing country. We also want to create many Singapores in India,” PM Modi said on his two-day visit to Singapore. Watch the video for details.   News / Videos / PM Modi Signs Big Semiconductor Deal With Singapore, Hails Country’s Inspiring Growth During Visit Source link